The oxidation furnace is set up for dry oxidation only (clean thermal oxidation - DRY) and therefore limited to oxide thickness of 200 nm. This makes it suitable for the fabrication of gate oxide in a ...

PECVD can be performed at lower temperatures compared to thermal CVD, making it suitable for heat-sensitive substrates in CMOS fabrication. Additionally, PECVD can enhance the deposition rate and ...

The periphery is thus subjected to several thermal treatments imposed by the fabrication of the storage capacitor ... has been involved in developing advanced CMOS, DRAM, NAND, emerging memory array, ...

Ltd. (“Calumino”), a leader in intelligent thermal imaging solutions, today announced their strategic partnership and the unveiling of their innovative, CMOS imager-based optical thermal ...