hereinafter "Resonac") has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process ...

Temporary Bonding Essential for Heterogeneous Integration Applications Temporary wafer bonding is a widely used method to ensure the processing of thin wafers (under 100-micron silicon thickness ...

EVG is participating with the following professional development course, papers and posters in the ECTC technical program ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...