On April 1, 2025, the Taiwanese manufacturer TSMC introduced the world's most advanced microchip: the 2 nanometre (2nm) chip. Mass production is expected for the second half of the year, and TSMC ...

TSMC has revealed its A14 (1.4nm-class) manufacturing technology, which it promises will offer significant performance, power, and transistor density benefits over its N2 (2nm) process.

Apple chipmaker TSMC says that it will make chips with a sub-2nm process size for the first time ever in 2028 ... referred to physical size of transistor gates in nanometers.

The increased transistor density alone, you would think ... back to customers that expect for the cost per unit of function will go down over time. In the March quarter, TSMC ended the quarter with ...

After TSMC began building Fab 21 near Phoenix, Arizona, the company said it needed to dispatch more than 1,000 skilled workers from Taiwan so it could complete the project on time and within budget.

TL;DR: TSMC's advanced 2nm process node, featuring GAAFET architecture, matches 5nm defect density ... node is the first time the company will be using all-around gate transistor (GAAFET ...

“Speed enhancement compared to N2 is up to 15 per cent, power reduction is at 30 per cent, logic density ... in time for next-gen smartphones, laptops, and edge devices to debut. TSMC is ...

In the coming years, the industry will require three distinct offerings from contract chipmakers in general, and TSMC in particular. Maximum transistor density and performance efficiency.

Compared to TSMC's N2 node, A14 promises up to 15% faster performance at the same power or up to 30% power savings at the same performance. A14 also boasts over 20% logic density improvement.