A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by Advanced Interconnect Technologies (AIT) meets... High-reliability packages, always in demand within the ...

Chiplets could reside in an existing package type or a new architecture. Making fan-outs IC packaging is an important part of the ... is working on a technology called System on Integrated Chip (SoIC) ...

[Pyra] was looking for a way to reprogram some ATtiny13 microcontrollers in a SOIC package. He’s re-engineering some consumer electronics so adding an ISP header to the design isn’t an option.

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem ... and 6x HBM stacks in a large package. This paves the way for a number of 3D-SoIC production ramps expected ...

It actually comes through the package ... IC design, different interconnects are used, including TSVs (through-silicon vias), interconnects in interposers, direct copper-to-copper bonding interconnect ...

Output is a voltage linearly proportional to the current, responding within 300ns. There are two base part numbers: CT455 comes in two 8-lead package options: SOIC and TSSOP CT456 uses differential ...

DUBLIN--(BUSINESS WIRE)--The "GaN-on-Sapphire HEMT Power IC by Power Integrations" report ... the HEMT and the package as well as the estimated selling price of the component.

Privately held EDA firm Sigrity is offering a new tool called CoDesign Studio that analyzes power across the IC and package. Prior to this release the company fielded two offerings: SPEED2000 and ...

Case in point: packaging. An IC package provides the electrical, thermal, and mechanical transition from the semiconductor die or chip to the circuit board, which is often called a motherboard.

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...