A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by Advanced Interconnect Technologies (AIT) meets... High-reliability packages, always in demand within the ...

Chiplets could reside in an existing package type or a new architecture. Making fan-outs IC packaging is an important part of the ... is working on a technology called System on Integrated Chip (SoIC) ...

[Pyra] was looking for a way to reprogram some ATtiny13 microcontrollers in a SOIC package. He’s re-engineering some consumer electronics so adding an ISP header to the design isn’t an option.

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem ... and 6x HBM stacks in a large package. This paves the way for a number of 3D-SoIC production ramps expected ...

It actually comes through the package ... IC design, different interconnects are used, including TSVs (through-silicon vias), interconnects in interposers, direct copper-to-copper bonding interconnect ...

Phison’s Redriver IC PS7101 effectively reduces the compatibility problems that may occur when connecting between the CPU and the endpoints. The company’s Flip-Chip package design further ...

Privately held EDA firm Sigrity is offering a new tool called CoDesign Studio that analyzes power across the IC and package. Prior to this release the company fielded two offerings: SPEED2000 and ...

Case in point: packaging. An IC package provides the electrical, thermal, and mechanical transition from the semiconductor die or chip to the circuit board, which is often called a motherboard.

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...