Apple will bring its next-generation M5 chip to the MacBook Pro in the fall, followed by the iPad Pro in the first half of 2026, according to Bloomberg 's Mark Gurman. Gurman's latest claim flips ...

Apple moves away from using TSMC's new 2nm process node for its next-gen M5 chip because of high costs, will use SoIC technology, expected in 2025.

Apple's next-gen M5 series processor: TSMC's advanced N3P node: M5 Pro, M5 Max, M5 Ultra use server-grade 2.5D packaging called SoIC-mH.

Packaging options for the dual JFET include surface-mount plastic SOIC 8L, PDIP 8L, and SOT-23 6L. It is also offered in TO-71 6L and TO-78 6L through-hole metal cans. The LS844 in the SOT-23 6L ...

HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its ...

The SGM8277-1 is available in Green SOIC-8 and TDFN-3×3-8L packages. The SGM8277-2 is available in Green SOIC-8, MSOP-8 and TDFN-3×3-8L packages. They are specified over the extended industrial ...

Simultaneously, the foundry's production capacity for 3D-stacked system-on-integrated chips (SoIC) packaging is set to undergo a significant boost, according to a report by Taiwan's .

The technology is tunneling magnetoresistance, and the sensors are intended to sit over the current-carrying PCB track to be measured. Output is a voltage linearly proportional to the current, ...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its ...

SoIC Capacity Expected to Double TSMC plans to significantly expand its SoIC capacity. According to the report, the company’s monthly SoIC production was around 4,000–5,000 wafers in 2024. That figure ...