Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the ...

Teradyne’s Magnum 7H memory tester for HBM devices provides test coverage from base-die wafer test to memory core test and ...

The team introduced a flexible three-dimensional probe array capable of adapting to the microscopic contours of micro-LED wafers, applying a pressure as low as 0.9 MPa, comparable to the softness ...

The team has developed a new soft-touch testing system that uses a flexible 3D probe array capable of adapting to the wafer’s microscopic surface, while applying a pressure as low as 0.9 MPa ...

Research from all publishers Recent developments in on-wafer probing have focused on enhancing both measurement precision and probe durability for high-frequency applications.

Keysight Technologies, Inc. (NYSE: KEYS) introduces the InfiniiMax 4 Series high-bandwidth oscilloscope probes, expanding its portfolio of high-freque ...

The team has developed a new soft-touch testing system that uses a flexible 3D probe array capable of adapting to the wafer’s microscopic surface, while applying a pressure as low as 0.9 MPa ...