The needles on the flexible substrate match special test structures when the probe card is positioned above them. The semiconductor process enables the needle's shape and diameter to be controlled, ...

Allowing �0.00025″ for planarity tolerance and assuming 0.0005″ for probe card deflection, the maximum OT could be only 0.00175″ for some probes, resulting in 2.45g and, as a result, a ...

Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test ...

Combining motion and machine vision expands inspection equipment capabilities.Motion control and machine vision are used throughout the semiconductor manufacturing process, from ...