The designer starts by capturing some very basic information about the die or the components that are in the design. Once the package designer has that basic information, Siemens Xpedition Package ...

IC package design best practices. In order to efficiently design new types of IC packages, designers and design teams need to embrace a new emerging set of best practice design techniques, processes ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Ball Grid Array (BGA) is a form of surface-mount packaging that makes the electrical connection between the IC and the PCB using a grid of solder balls. On the backside of the BGA package is a network ...

IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin, Ireland (OIF booth 441).

Co-design of IC and package with RDL and package fan-out escape routing This integrated co-design environment permits a unique design approach unavailable in discrete or limited 2D tools. For example, ...