GUC recently presented their multi-die tape-outs at SNUG Silicon Valley 2024, which were made more efficient by Synopsys’ 3DIC Compiler through the implementation of die floorplanning and related bump ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new ...

Broadcom was an early proponent of the tech, but in the past few months, its name has disappeared from the UALink Consortium ...

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

ARLINGTON, Va., Feb. 1, 2024 /PRNewswire/ -- Raytheon, an RTX (NYSE: RTX) business, has been awarded a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted ...

iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip ...

Intel Corporation INTC recently delivered cutting-edge multi-chip package (MCP) prototypes to support the DoD’s (Department of Defense) mission to modernize and enhance the defense industrial ...

Similar News Stories. Intel's next-gen Xeon 'Clearwater Forest' CPU package spotted: the first Intel 18A chip; Palmer Luckey-founded Anduril inks huge US Army deal: 'turning soldiers into superheroes' ...

The A20 chip that will be used in the iPhone 18 could be packaged with a new tech that will give Apple more configuration options, while still being as small as possible.

Collaboration will accelerate the delivery of microelectronics packaging for military systems ARLINGTON, Va., Feb. 1, 2024 /PRNewswire/ -- Raytheon, an RTX (NYSE: RTX) business, has been awarded a ...