Its products include complementary metal-oxide semiconductor image sensor; micro-electromechanical systems; and ball grid array system in package, multi-chip package, multi-chip module ...

As computing shifts from single-chip processors to multi-chip systems, traditional communication methods, such as Network-on-Chip (NoC) and Network-in-Package (NiP), are becoming less efficient.

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...