Achieving integration of semiconducting and superconducting qubits with full industrial 300-mm wafer fabrication.

Many MEMS devices need to be protected from the external environment or can operate only under controlled atmosphere or vacuum. Metal-based wafer bonding (Eutectic, Transient-Liquid-Phase and ...

For [emach1ne], the DIY LED was part of a Master’s degree course and began with a slice of epitaxial wafer that goes through cleaning, annealing, and acid etching steps in preparation for ...

Akustica's technology is revolutionary in both the new products it enables and the fabrication methods by which those products are manufactured. CMOS MEMS structures are composed of the ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

March 20, 2025 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announced it has engaged Macquarie Group to oversee the marketing and sale of its wafer fabrication facility (“Fab 2 ...

Manoj Wadhwa, group head at VLSI (Very Large Scale Integration) and MEMS (micro-electromechanical system) fabrication group ... wafers per month — 180 nm. Wafer acts as the foundation for ...