EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.

EV Group, an Austria-based supplier of equipment and process solutions for semiconductors, showed the next-generation version ...

Wafer bonding has become a fundamental core capacity for any high-volume MEMS production facility that makes anything from accelerometers to silicon sensors for automotive, aerospace and consumer ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

EVG has already delivered several GEMINI systems built on the new equipment platform to multiple leading MEMS manufacturers. EVG GEMINI 300-mm high-force automated production wafer bonding system.