Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...

This Calibre certification allows mutual customers to continue leveraging the Calibre® nmPlatform tool as their industry-standard sign-off solution with Intel Foundry's most advanced manufacturing ...

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The advanced packaging methods let Intel advance some processor elements faster ... "The thing that we were most worried about was advanced packaging," but the 47 chiplets went together smoothly ...

Secondly, reflecting on the Intel advance packaging plant setup chronology ... The semiconductor sector has become the most critical bargaining chip in the duel of global superpowers, presenting ...

the tech company is investing over $4 billion to advance the production of its 3D packaging technology, called Foveros, and other advanced chip packaging capabilities. “With Intel 3 already in ...

The award will support Intel’s previously announced plans to advance critical semiconductor ... many of the world’s most advanced chips and semiconductor packaging technologies, including ...

Intel is the largest player, by far, in one of the state’s largest industries. Oregon exports more than $30 billion worth of electronics annually, most of ... of winning a packaging and ...