In this paper, we present the results of an evaluation of the 3D Through-Silicon-Via (TSV) technology, using the Timepix4 integrated circuit as a test-vehicle. We will present the concepts for 3D ...
[2] Yukio Okuda, “Diagnosis meets Physical Failure Analysis: How long can we succeed?,” Int. Test Conference 2004, pp 1438, 2004. [3] M. Slamani, “Testing highly integrated wireless circuits and ...
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