Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

Physical stress will become a major factor in successful die and package-level design. The simulation tools for 3D IC thermo-mechanical stress evaluation have mostly been custom in-house software.

Enter FUTUR-IC, a new research team based at MIT and funded by the National Science Foundation’s Convergence Accelerator through a cooperative agreement. “Our goal is to build a microchip industry ...

The future of digital computing and communications will involve both electronics—manipulating data with electricity—and ...

As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning ...

During the 1980s a lot of consumer devices suddenly got a lot smaller as large-scale integration using semiconductor ...

Taipei [Taiwan], July 28 (ANI): Taiwan semiconductor industry faced a labour shortage of 34,000 workers as of May this year, ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Case in point: packaging. An IC package provides the electrical, thermal, and mechanical transition from the semiconductor die or chip to the circuit board, which is often called a motherboard.