As ICs and packaging options like flip chips become more complex, engineers have a growing need for accurate power analysis across the IC and package, according to Jiayuan Fang, Sigrity's president.

Michael Walsh (all posts) Michael Walsh is the Technical Director for IC Packaging Solutions at Siemens EDA, where he has worked in various Application Engineering roles since 1992. Walsh has worked ...

YouTuber engineer unleashes new ‘glitter bombs’ on package thieves by: NewsNation staff, Nexstar Media Wire Posted: Dec 19, 2021 / 05:08 PM CST Updated: Dec 19, 2021 / 05:09 PM CST ...

NASA engineer forced to admit his viral glitter bomb package was a FRAUD: Scientist, who won internet fame with exploding 'revenge' box targeting porch thieves reveals the footage was fake Mark ...

The porch piracy problems were not all what they seemed. The idea was glorious: To get revenge on thieves swiping packages off doorsteps, ex-NASA engineer Mark Rober built parcels with a pound of ...

This higher level of integration enables engineers to design concurrently across the chip, package and board. By automating what has until now been a manual process, the Virtuoso System Design ...

The design environment called Xpedition Package Integrator flow can be used to integrate existing IC, package and PCB design tools from Mentor and even third party tools. According to Mentor, the ...

IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world’s largest consumer of packaging equipment and materials, says SEMI. China’s IC packaging and testing ...