A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

“It’s not just 3D that’s happening. It’s smaller pitch sizes and smaller interconnects. When you look at the physics behind penetrating into a package and identifying different layers in that package, ...

IR’s new IRS2505L power factor correction boost IC comes in a 5-pin SOT23 package for switch mode power supply, LED drivers, and fluorescent and HID electronic ballast applications.

Power Integrations added a wide-creepage package option to its InnoSwitch3-AQ flyback switcher IC for automotive applications: A wide drain-to-source-pin creepage distance of 5.1 mm eliminates the ...