The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D ... Each of these interconnect structures are used for a particular package type. And each one has a number ...

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

Privately held EDA firm Sigrity is offering a new tool called CoDesign Studio that analyzes power across the IC and package. Prior to this release ... “Users can also try different packages with their ...

The key to such technology is to use both internal and external cooling circulation systems to work together in a single IC package ... of product solutions for different application scenarios ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

Recently, a new technology known as Quilt Packaging (QP) has evolved, which holds high promise for lowering cost and boosting system-level IC package performance ... The OLS4000 is used at different ...

Incorporating both a photodiode and a signal processing circuit, the EIC-3200 series of photo IC sensors is said to be the first such device to be housed in a surface-mount package. The sensorÕs ...