Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

(Image Source: Intel) The evolving landscape of packaging design demands that ... vias and copper for the IC current requirements is essential to success. As multiple dies are integrated into a ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...

Full suite of Cadence digital, signoff and custom/analog IC design tools coupled with advanced IC package design and analysis tools optimized for TSMC WoW technology SAN JOSE, Calif. -- May 1, 2018 -- ...

Allegro's ACS37030 50-A current sensor protects wide-bandgap GaN devices by sensing current over the industry’s widest ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

There are several varieties of integrated circuits, each with its own circuit design and outer shell requirements. This leads to many sorts of IC package designs and classification schemes. With the ...

3D ICs represent an expansion of heterogeneous advanced package technology into the third dimension, presenting similar design to manufacturability challenges ... in advanced heterogeneous packaging ...

This not only simplifies the design process, but also ensures consistent power delivery across the entire IC package. To illustrate the benefits of this approach, consider an SoC design with four HBMs ...

PENANG plans to offer an annual incentive package worth up to RM2mil to attract more integrated circuit (IC) design companies ...