Vietnam's successful bid to develop a vibrant IC design industry will integrate it into the global semiconductor ecosystem.

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design ...

In this 3D integration scenario, an important differentiator is that interposers and 3D chip stacks are still attached to BGA and LGA packages, which then are mounted to the PCB. These interposers are ...

The increasing complexity of integrated circuit (IC) designs is straining our traditional design rule checking (DRC) methods. The iterative “construct by correction” approach that worked well for ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

The first planned IC design hub is being housed in the ... but only at the lower end of the spectrum. With the design and advanced packaging element coming into play, hence the ODM dream.

Fig.2. Failure analysis methodologies used in IC development (a) (b) [1] JCH Phang, DSH Chan, M. Palaniappan, JM Chin, B. Davis, M Bruce, “A review of Laser Induced Techniques for Microelectronic ...

Advanced Packaging, AI Demand Drive Taiwan Semiconductor Expansion into 2025Dublin, Jan. 28, 2025 (GLOBE NEWSWIRE) -- The "Taiwan Semiconductor Industry: 4Q 2024 Performance and 2025 Outlook" report ...