Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

(Image Source: Intel) The evolving landscape of packaging design demands that ... vias and copper for the IC current requirements is essential to success. As multiple dies are integrated into a ...

Full suite of Cadence digital, signoff and custom/analog IC design tools coupled with advanced IC package design and analysis tools optimized for TSMC WoW technology SAN JOSE, Calif. -- May 1, 2018 -- ...

Allegro's ACS37030 50-A current sensor protects wide-bandgap GaN devices by sensing current over the industry’s widest frequency range for automotive, industrial, and ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design ... while enabling global resource optimization, chip-package co-design and advanced multiphysics convergence analysis ...

3D ICs represent an expansion of heterogeneous advanced package technology into the third dimension, presenting similar design to manufacturability challenges ... in advanced heterogeneous packaging ...

This not only simplifies the design process, but also ensures consistent power delivery across the entire IC package. To illustrate the benefits of this approach, consider an SoC design with four HBMs ...

PENANG plans to offer an annual incentive package worth up to RM2mil to attract more integrated circuit (IC) design companies ...

Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring wide-creepage package “The new ... and two design example reports (DERs) are: Power Integrations ...

That is the consideration the federal government is looking for,” he said at the launch of the Malaysia Semiconductor Integrated Circuit (IC) Design Park in Puchong yesterday. Rafizi stated that ...