Additive manufacturing (AM), otherwise known as 3D printing, is an incredible process that creates three-dimensional, physical objects via a computer design file. Challenges when dealing with high ...

Design tradeoffs: Ultimately, almost every facet of increasing power density is about tradeoffs. Balancing the need for high power density with other factors like efficiency, cost, and reliability ...

A new technical paper titled “Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization” was published by researchers at Corintis. Abstract: “The continuous ...

His design and research interests include high-efficiency and high-power-density power conversion, soft-switching converters, and GaN implementation in AC/DC converters. Max obtained a master’s degree ...

With an industry as large as semiconductors, there are often surprises lurking in some of the more specialized product categories. Everyone knows that huge chips such as CPUs and GPUs command high ...

Engineered to simplify switching behaviors and design challenges commonly experienced in high-power designs, Gen 4 charts a long-term roadmap across Wolfspeed’s product categories, including ...