eaglei 200 is available for 2" to 200mm wafer cassette & carrier inspection and eaglei 300 for automated 300mm foup and fosb wafer carrier inspection. represents the union of two industry-leading ...

The F300 AutoPod that uses the polymer comes from Entegris Inc., Chaska, Minn. The Foup combines a wafer carrier and a pod in a single enclosure. Its carrier holds 25 wafers and the pod is ...

The new FOUP features a metal-free door for prevention of corrosion ... vice president and general manager of Asyst's Wafer and Reticle Carrier Business Unit. Asyst said the new SMIF-300FL series 3-EP ...

CHASKA, Minn.– Entegris Inc. here today announced enhancement to its 300-mm front opening unified pod (FOUP), featuring a new “AutoPod” door designed to improve interoperability with a variety of load ...

FEI has released the Helios NanoLab™ 1200AT, the newest generation of its full-wafer DualBeam™ analysis systems. The addition of an optional automated FOUP (front opening universal pod) loader allows ...

Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics (HLMC ...

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, has obtained new wafer carrier orders from China which are ...