GIDL is primarily caused by band-to-band tunneling (BTBT) at the drain junction under high electric field conditions. This ...
Current DRAM chips belong to the ’10-nm class’ (denoted as D1x, D1y, D1z, D1a…), where the half pitches of the active area in the memory cell array range from 19 nm down to 10 nm. However, the ...
DRAM is the type of RAM you find on the RAM cards inserted into your motherboard. It consists of a massive array of capacitors and transistors. Each bit requires one transistor and one capacitor ...
27don MSN
Sandisk has positioned 3D Matrix Memory as an affordable solution in response to the end of Moore’s Law for DRAM ... on a ...
NEO Semiconductor’s 3D X-DRAM™ is a first-of-its-kind 3D NAND-like DRAM cell array structure based on floating body cell technology. It can be manufactured using today’s mature 3D NAND-like process.
based Kaminario comes to $65 million. Kaminario is a developer of an all solid-state Flash and DRAM SAN storage solution, the Kaminario K2, which was first released in 2010. It features a scale ...
May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP ... in particular in the cell phone, hard disk drive, and ...
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