But damage to a particular die on a wafer can be remedied only by designating ... trace that shows some horizontal as well as vertical movement. A bent probe tip will scratch the wafer surface as it ...

The Single Die Alignment feature makes it possible to automatically probe a wafer with inconsistent die to die spacing, or rotationally misaligned die, without having to make any manual ...

Dice being singulated with a diamond saw The general plan is to use testing at a variety of points to improve overall quality, by weeding out bad wafers (PCM data) bad die (wafer probe ...

One takes an array of bumps on a wafer and matches them to an array of probe tips. The other takes an array of bumps on a die and matches them to an array of pads/bumps on a substrate assembly. To ...

Two key trends are converging on wafer probe, leading the need to rethink ... solutions where multiple known-good die (KGD) are mounted in a single package. Examples of modern MCPs include mixed ...

FormFactor Inc. has developed a family of advanced wafer probe cards designed to address the rising cost ... bond logic and SoC manufacturers need to lower their test cost per die and support their ...

The introduction of the double-sided wafer probe test cell is expected to have ... this solution addresses the critical need for known good die testing before wafers are diced and packaged into ...