But damage to a particular die on a wafer can be remedied only by designating ... trace that shows some horizontal as well as vertical movement. A bent probe tip will scratch the wafer surface as it ...

For wafer test (sort or probe), this interface hardware is called a probe card, and prober equipment manages the physical process of touching a probe tip onto a die pad/bump. Consider first the ...

Dice being singulated with a diamond saw The general plan is to use testing at a variety of points to improve overall quality, by weeding out bad wafers (PCM data) bad die (wafer probe ...

The introduction of the double-sided wafer probe test cell is expected to have ... this solution addresses the critical need for known good die testing before wafers are diced and packaged into ...

In the front-end, diffusion, etching, oxide growth, and metallization are among the process steps required to create a wafer ... s Probe One Memory Test System with adjustable die boundaries.