Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...

Teradyne’s Magnum 7H memory tester for HBM devices provides test coverage from base-die wafer test to memory core test and ...

PARIS — Probe card manufacturer Mesatronic SA is ramping up production of die-on-die (DOD) membrane probes for IC testing, in its 100 class clean room near Grenoble, France. The company is also ...

Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and ...

NORTH READING, Mass., March 31, 2025--Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test ...

The probe-card die are tiled onto a ceramic substrate that also can carry conventional power and ground probes. Because of the small size of the transceivers and antennas, wafer-scale noncontact ...

The team has developed a new soft-touch testing system that uses a flexible 3D probe array capable of adapting to the wafer’s microscopic surface, while applying a pressure as low as 0.9 MPa ...

The team has developed a new soft-touch testing system that uses a flexible 3D probe array capable of adapting to the wafer’s microscopic surface, while applying a pressure as low as 0.9 MPa ...