The chucks developed and manufactured by Berliner Glas already have been made as resistant as possible to particle contamination by using a special pin or mesa design. The contact area between the ...

Since the early days of the IC industry, wafer-level test has ... to Z-axis motion on the chuck. One of the critical aspects of this system is maintaining contact with the DUT while it is moving ...

CoreFlow Ltd. is proud to unveils its groundbreaking GripJet™ vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes. By Eliminating the need for ...