News

Optics9y
Perfecting Chucks: Wafer Backside Particle Reduction – Berliner Glas Group publishes white paper
The chucks developed and manufactured by Berliner Glas already have been made as resistant as possible to particle contamination by using a special pin or mesa design. The contact area between the ...
Electronic Design20y
Testing MEMS at Wafer Level
Since the early days of the IC industry, wafer-level test has ... to Z-axis motion on the chuck. One of the critical aspects of this system is maintaining contact with the DUT while it is moving ...
Business Wire9y
Small Japanese Technology Developer Yoshioka Seiko Releases "Hot Vacuum Chuck (HoVaC)" Based on Sub-50μm Ultra-Thin Semiconductor Silicon Wafer Surface Adsorption Technology
Enables adsorptive immobilization with a high extraction rate without deforming thin, sub-50μm semiconductor wafer ... Porous Chuck, or wish to know more details, please contact our Shanghai ...
PR Newswire1y
ERS electronic introduces "High Power Dissipation" Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test
ERS's new "High Power Dissipation" System can dissipate wattage up to 2.5kW at -40°C on a 300 mm chuck, thereby allowing the testing of single dies as well as tests with full wafer contact.
ksn.com1y
CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening at Advanced Semiconductor Wafer-Level Packaging Processes
CoreFlow Ltd. is proud to unveils its groundbreaking GripJet™ vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes. By Eliminating the need for ...
The Victoria Advocate1y
Technical University of Denmark Installs New Takano Wafer Particle Measurement System from ClassOne Equipment
For detailed information, contact sales@classoneequipment.com ... fully supports the Takano line of all-new high-performance wafer particle inspection systems. ClassOne Equipment supplies a ...