SAN JOSE, Calif.--(BUSINESS WIRE)--Western Digital Corp. (NASDAQ: WDC) today announced that it has successfully developed its fifth-generation 3D NAND technology, BiCS5, continuing the company’s ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Western Digital Corp. (NASDAQ: WDC), a global data storage technology and solutions leader, today announced that it has received the Flash Memory Summit ‘Best of ...

The global 3D NAND flash memory market size was US$ 14.9 billion in 2021. The global 3D NAND flash memory market size is forecast to reach US$ 79.2 billion by 2030, growing at a compound annual growth ...

Micron Technology, Inc. MU is scheduled to report fourth-quarter fiscal 2025 results on Sept. 23, 2025, after market close. The company projects fiscal fourth-quarter revenues to be $10.7 billion ...

While Micron Technology (MU) is looking to differentiate its 3D NAND flash technology from the rest in the industry through unique architecture, the joint venture between SanDisk (SNDK) and Toshiba ...

On March 26th, Micron and Intel announced the sampling availability of their jointly developed 3D NAND technology. This technology, according to the press release, promises to bring "significant ...

The latest 3D NAND technology offers some unique benefits and features that every engineer is going to want to learn about. New 3D NAND technology is essential for the ever-growing flash memory ...

NEO Semiconductor has announced that it has developed the "world's first 3D NAND-like DRAM cell array," which aims to increase DRAM chip density using established 3D stacking technology. Designed to ...

In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage ...

Micron and SK Hynix are turning up the pressure on each other with 3D NAND chips made up of more than 230 layers. Check out more coverage of the 2022 Flash Memory Summit. Memory chip giants are upping ...

What just happened? A Californian company is launching what it calls a ground-breaking solution for increasing DRAM chip density with 3D stacking technology. The new memory chips will greatly improve ...