Using UMC’s 40nm low power process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and ...

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter ...

With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends Janet Kang, Taipei; Willis Ke, DIGITIMES Asia Monday 11 September 2023 0 ...

Next-generation optical inspection is about more than just sensitivity. It’s about reliably seeing through complexity.

Adeia Inc., a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded ...

“The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

HSINCHU, Taiwan& SAN JOSE, Calif.---- United Microelectronics Corporation, a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence ® 3 D-IC ...